HSR Technology

BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is  a soft and compliant gap filling material  with  a thermal conductivity of 5.0 W/m-K.  The material offers exceptional thermal  performance  at low [...]

BERGQUIST GAP PAD TGP 5000 is a fiberglass-reinforced filler and polymer featuring  a high thermal conductivity. The material yields extremely soft characteristics while maintaining  elasticity and conformability. The [...]

BERGQUIST SIL PAD TSP Q2500 is a composite of aluminum foil-coated on both sides with thermally and electrically conductive SIL PAD rubber. The material is designed for those applications in which maximum heat transfer [...]

Bergquist GP3000S30 is a soft gap filling material rated at a thermal conductivity of 3 W/m-K. The material offers exceptional thermal performance at low pressures due to an allnew 3 W/m-K filler package and low-modulus [...]

BERGQUIST SIL PAD TSP PPK900, Polyester-Based, Thermally Conductive Insulation Material BERGQUIST SIL PAD TSP PPK900 Known as BERGQUIST POLY-PAD K-4 BERGQUIST POLY-PAD K-4 is a composite of film coated with a polyester [...]