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Bergquist Gp5000s35 Gap Pad 5000s35 Gap Pad Tgp 5000

Selling Price: USD 1 / Piece
Minimum Order Quantity:  10 Piece
Shipment Delivery Time:  1 week
Shipment Port:  shenzhen
Currency Options:  USD
Language Support:   English, Chinese
Certification:  Inquire
Production Capacity: 10000pcs/week Piece
Primary Business:  Manufacturer
Packaging:  box
Preferred Payment Method:
BERGQUIST GP5000S35 GAP PAD 5000S35 GAP PAD TGP 5000 Details

BERGQUIST GAP PAD TGP 5000 is a fiberglass-reinforced filler and polymer featuring

 a high thermal conductivity. The material yields extremely soft characteristics while maintaining 

elasticity and conformability. The fiberglass reinforcement provides easy handling and converting,

added electrical isolation and tear resistance. The inherent natural tack on both sides assists in application 

and allows the product to effectively fill air gaps,enhancing the overall thermal performance.The top side has

 reduced tack for ease of handling. BERGQUIST GP5000S35  is ideal for high-performance

applications at low mounting pressures.

 

BERGQUIST GAP PAD 5000S35  Typical Applications Include:

• Voltage Regulator Modules (VRMs) and POLs

• CD-ROMs and DVD-ROMs

• PC Board to chassis

• ASICs and DSPs

• Memory packages and modules

• Thermally-enhanced BGAs

Configurations Available:

• Die-cut parts are available in any shape or size, separated or in sheet form

About Hsr Technology
Business Type: Manufacturer
Country / Region: Guangdong, China
Main Products: Bergquist Thermal Insulation Materials...
Total Annual Revenue: Not Provided
Year of Establishment: 2022
Business Nature

Manufacturer

Year Established

2022

Country/Region

Shenzhen, China

Main Products

Bergquist Thermal Insulation Materials...

Payment Terms

Bank wire (T/T)

About HSR Technology

Shenzhen Hothree Technology Co., Ltd. was established in 2011. It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems. The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist , LAIRD in the US and Denka in Japan. At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity. Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment. Company culture, Integrity and pragmatism, quick response, keep improving.

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To: Bergquist Gp5000s35 Gap Pad 5000s35 Gap Pad Tgp 5000
From China 1st Year
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Business Type:
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Response:
84%
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Building F3, Jinyucheng Park, Longg , Guangdong , Shenzhen , China

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