Diamond Lapping Compound

Diamond paste is strictly selected high-quality diamond powder as raw materials, high hardness, uniform particle size with high grinding force, superfine surface finish and uniform abrasive. Diamond lapping paste is divided into water-soluble paste and oil-soluble paste. For raw materials, it is also divided into polycrystalline diamond paste and monocrystalline diamond paste.

It is suitable for the grinding and polishing of metals, tungsten carbide, mold, alloys, glass, ceramics, semiconductors, jade, and other hard materials

*Water-Soluble Diamond Lapping Compound

Good wettability and low viscosity, easy to cut.

Low grinding heat and high processing efficiency.

It is mainly used for precision Engineering and Electronic; also suitable for the preparation of tools and dies that will be subsequently electroplated or chemically or physically coated

*Oil-Soluble Diamond Lapping Compound

Easy removal, high processing efficiency.

Stable to 200°C, allowing work on un-cooled molds. Oil-based carrier with superior lubricant qualities to improve the surface finish.

It is suitable for circuit boards, glass & ceramics, gemstones, agate slightly corrosive metals