texturing additive for the process of texturing of monocrystalline silicon wafers

RFQ Description

Properties Characteristic Purpose of the additive For high efficiency cells (efficiency not less than 23%) Number of components Single component Character of texturing Homogeneous texturing of the wafer surface with average pyramid sizes between 1-6 μm Reduction of average reflectance Down to below 11,5 % at a wavelength from 400 to 1100 nm Time of the texturing process Not more than 12 minutes Temperature of the texturing process Not more than 82 °С Requirements for the composition (environmental aspect and reliability of equipment operation) IPA-free Compatible with NaOH and KOH Compatible with both Lifetime of a texturing bath (including dosing) At least 250 processes Expiration date At least 6 months Delivery form In an acid-alkali-resistant sealed container with a volume of 1000 liters (Eurocube)