WUHAN HUAMEIHUA GROP

We are WUHAN HUAMEIHUA GROP based in Wuhu , China. We are member of exporthub.com since February, 2010. Our business is related to Minerals & Metallurgy industry and we specifically deal in Epoxy Resin,carbamide,ironstone,sofe coal.... Please find our product details below:FERTILIZER UreaSPECIFICATIONS : UREA FERTILIZER C 46%N GRANULAR NITROGEN : 46% BY WEIGHT MIN.(DRY METHOD) BIURET : 1% MAX. BY WEIGHT MOISTURE : 0.5% MAX. (BY METHOD OF DRYING) FREE AMMONIA : 160 PXT PPM MAX. GRANULATION : 2-4 MM, 90% MIN BY WEIGHT PRICE: USD315/T FOB CHINA 3300TEPOXY RESINOur primary products cover 50 varieties of ten sorts including CYD-eporxy resin, E-epoxy resin , special epoxy resin, curing agent for epoxy resin, allyl chloride and soda. A type of basic epoxy resin Bisphenpl a liquid Epoxy Resin. It is colorless or yellowish viscous lipuid with low toxicity, which mainly usde in coating, adhesive, anticorrosion, electric insulation, laminated plates and potting fields or used as the raw material for high-grade epoxy resin processing Medium-and high-Molecular Weight solid BPA epoxy is coloriess or light yellow with low toxicity, It is widely used in many fields such as coating paint and anticorrosion Solvent-type Eppxy Resin is widely used in such fieldsas adhesive coating anticorrosion Brominated Epoxy Resin is used as flame retardant sealing material flame retardant laminated plates and adhesives in the fields of electronics eletric appliance ships and civil construction. CYDB-450A80 is especially suitable for FR-4 copper clad laminates production when combined with dicyandiamide and imidazole curing agent o-Cresol Formaldehyde Epoxy Resin is used in microelectronic industry, used for the encapsulant of semiconductors and integrated circuits Phenolic Epoxy Resin can be used as a modifier for electonic lamination powder coating mould plastics liquid insulation coating engineering materials of various structure reinforced plastics and its predipping embryo thermal resistance adhesive and printing ink to produce higher glass transition point and crosslinking density for cured systems Waterborne Epoxy Resin can be mixed with such common cement-based material as cement mortarand concrete to enhance the early strength, tenaciy, impact resistance and waterproof ability of above materials with very high crosslinking density Functional Epoxy Resin, this high molecule compound of low toxicity and light yellow is characterized by wide molecular weight distribution and even polymerization degree. applied in coating paintingFERTILIZER UreaSPECIFICATIONS : UREA FERTILIZER �C 46%N GRANULAR NITROGEN : 46% BY WEIGHT MIN.(DRY METHOD) BIURET : 1% MAX. BY WEIGHT MOISTURE : 0.5% MAX. (BY METHOD OF DRYING) FREE AMMONIA : 160 PXT PPM MAX. GRANULATION : 2-4 MM, 90% MIN BY WEIGHT PRICE: USD315/T FOB CHINA 3300TEPOXY RESINOur primary products cover 50 varieties of ten sorts including CYD-eporxy resin, E-epoxy resin , special epoxy resin, curing agent for epoxy resin, allyl chloride and soda. A type of basic epoxy resin Bisphenpl a liquid Epoxy Resin. It is colorless or yellowish viscous lipuid with low toxicity, which mainly usde in coating, adhesive, anticorrosion, electric insulation, laminated plates and potting fields or used as the raw material for high-grade epoxy resin processing Medium-and high-Molecular Weight solid BPA epoxy is coloriess or light yellow with low toxicity, It is widely used in many fields such as coating paint and anticorrosion Solvent-type Eppxy Resin is widely used in such fieldsas adhesive coating anticorrosion Brominated Epoxy Resin is used as flame retardant sealing material flame retardant laminated plates and adhesives in the fields of electronics eletric appliance ships and civil construction. CYDB-450A80 is especially suitable for FR-4 copper clad laminates production when combined with dicyandiamide and imidazole curing agent o-Cresol Formaldehyde Epoxy Resin is used in microelectronic industry, used for the encapsulant of semiconductors and integrated circuits Phenolic Epoxy Resin can be used as a modifier for electonic lamination powder coating mould plastics liquid insulation coating engineering materials of various structure reinforced plastics and its predipping embryo thermal resistance adhesive and printing ink to produce higher glass transition point and crosslinking density for cured systems Waterborne Epoxy Resin can be mixed with such common cement-based material as cement mortarand concrete to enhance the early strength, tenaciy, impact resistance and waterproof ability of above materials with very high crosslinking density Functional Epoxy Resin, this high molecule compound of low toxicity and light yellow is characterized by wide molecular weight distribution and even polymerization degree. applied in coating paintingThank you for taking the time to go through our business profile. If there are any question, inquiry or comments, please feel free to contact us.