Docbond|underfill
New Products From This Supplier
DOCBOND Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, effectively reducing the impact caused by the mismatching of overall temperature expansion characteristics between the silicon chip and the
substrate or external forces. Fast curing when heated. The lower viscosity characteristics allow for better underfilling; and good reworkability.
Business Nature
Manufacturer
Country/Region
Qingdao, China
Main Products
Fuel...
Payment Terms
Bank wire (T/T)
Qingdao Docbond New Material Co., Ltd. is a high-tech enterprise with independent intellectual property rights and patented technology for research, development, production, and marketing of hydrogen energy fuel cell composite bipolar plates. It was established on December 2020. It was jointly established by Qingdao Hanlan Co. Ltd, Huizhou Docbond new materials Co. Ltd. and Qingdao Yanhai carbon materials Co. Ltd; The first investment in phase was 100 million yuan. The company’s phase
