Ep10c7 One Part Non Sag Elevated Temperature Cure Epoxy Encapsulant Glue Cob Adhesive Pcb

EP10C7 One part non sag elevated temperature cure epoxy encapsulant glue COB adhesive PCB from FONG YONG CHEMICAL CO., LTD. are made available in different variations with quality commitments that has no match, making our Epoxy Encapsulant and adhesive,silicone,ab glue,epoxy resin,polyurethane pu resin highly demanded in the market. Being a quality-conscious entity and a leading Manufacturer and Importer of EP10C7 One part non sag elevated temperature cure epoxy encapsulant glue COB adhesive PCB, we make sure that all our products perfectly comply with the laid industry standards and boast supreme quality. The high-tech storage facility and an ultramodern inventory management system cater to annual 200 KGs production capacity, keeping the consumer reliability in check. Our minimum order quantity for EP10C7 One part non sag elevated temperature cure epoxy encapsulant glue COB adhesive PCB, is 1 KGs, thanks to the vast distribution network, it has always been easy for us to deliver bulk and retail orders. Located in Taipei, Taipei, SHULIN, FONG YONG CHEMICAL CO., LTD. is flexible in making deliveries for EP10C7 One part non sag elevated temperature cure epoxy encapsulant glue COB adhesive PCB, with in 10 - 15 Working Days, through SHULIN port, using multiple freight options including FOB, CIF. The price of these EP10C7 One part non sag elevated temperature cure epoxy encapsulant glue COB adhesive PCB starts from 7.68 per KGs price range. For payments TWD,USD currency modes are accepted and options like T/T, D/P are available for buyers.