Epoxy Underfill Encapsulant Cspbgaubga Of Mobile Phone Laptop
Selling Price:
USD 8.39 / KGs
Minimum Order Quantity:
2 KGs
Shipment Delivery Time:
10 - 15 Working Days
Shipment Port:
Dongguan
Currency Options:
CNY,USD
Language Support:
English, Chinese
Certification:
Inquire
Production Capacity: 60 KGs
Primary Business:
Manufacturer
Packaging:
Standard
Preferred Payment Method:
New Products From This Supplier
Epoxy Underfill Encapsulant CSPBGAuBGA Of Mobile Phone Laptop Details
We are known for producing the best epoxy encapsulant in the large scale market worth wise. We are introducing overall marketplace with cheap rates for epoxy encapsulant and thermally conductive compound,electrically conductive silver paste,rtv sillicone,uv adhesive,instant adhesive products made in dongguan. If you are on a lookout for a admirable dongguan thermally conductive compound,electrically conductive silver paste,rtv sillicone,uv adhesive,instant adhesive products manufacturer that has speciallized in adhesives, glue and sealants, then Our company is the best option. Our company is a recognized firm in dongguan that is trading transnationally.
About Dongguan Hongle Chemical Co., Ltd.
Business Type:
Manufacturer
Country / Region:
Guangdong, China
Main Products: Thermally Conductive Compound, Electrically Conductive Silver Paste, Rtv Sillicone, Uv Adhesive, Ins...
Total Annual Revenue:
Approx 2 Million US Dollar
Year of Establishment:
2010
Certificates:
ISO9001
Main Markets:
Bangladesh 25%, Sri Lanka 15%, Vietnam 22%, United States 10%, Singapore 21%,
Epoxy Underfill Encapsulant CSPBGAuBGA Of Mobile Phone Laptop Features
|
Grade Standard |
Agriculture Grade |
|
Surface of Application |
Other |
