






Semi-auto Thin Wafer Bonder Of E-chuck Carrier
New Products From This Supplier
(1) PVD, CVD, Plasma ETCHER, ION Beam Trimming (IBT)
(2) Thin Wafers, Warp Wafers
(3) Flat Glass
(4) Micro-LED
(5) 3D IC Fabric Package, MCM, MCP
(6) Soft Copper Foil
(7) Soft Film
(8) Vacuum Lamination for OLED or Touch Panel
(9) Shape Reinforcement Carrier (Eg, 4" Wafer-on-6" E-Chuck)
Automation Grade |
Semi-Automatic |
Design Type |
Other |
Driven Type |
Electric |
Packaging Type |
Other |
Brands |
Other |
I deal in |
New Only |
Speciality |
Other |



Business Nature
Manufacturer
Country/Region
Zhubei, Taiwan
Main Products
Wafer Foundry, E-chuck, Electrostatic Chuck...
Payment Terms
Bank wire (T/T)
EDRAGON TECHNOLOGY CORPORATION provides many advanced solutions for semiconductor engineering and related automation solutions. EDRAGON is honored to propose practical and reliable solutions for customers. Welcome to contact EDRAGON, we will provide you professional services. EDRAGON should be one of your important partners to each potential markets, especially ASEAN, and Asia-Pacific Areas.