Sn99.3cu0.7 Solder Ball For Sale
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sn99.3cu0.7 Solder Ball
Product: Solder Ball
Product composition: tin 99.3 copper 0.7
Product size: 13mm 19mm 22mm
customizable
Product weight: can be customized
Solder ball is an indispensable and important material in new packaging. It is a new connection method that meets the requirements of electrical interconnection and mechanical interconnection. Due to the rapid development of BGA and CSP in recent years, it has replaced the traditional pin package and lead frame package, thus playing an important role in electrical interconnection and mechanical support in solder balls. BGA, CSP and other packaged devices connected by solder balls are widely used in notebook computers, mobile phones, PDAs, DSCs, LCDs and 3C products. This provides a broad application market and development prospects for solder ball products.
Business Nature
Manufacturer
Country/Region
Qingdao, China
Main Products
Tin Rod, Tin Bar, Tin Block, Tin Ingot...
Payment Terms
Western Union (WU), Doc Against Acceptance (D/A), Doc Against Payment (D/P), Bank wire (T/T)
Qingdao StarGood Nonferrous Metal Co., Ltd. , focusing on the research and development, production, sales and export of tin products。The products are of good quality and full range, including tin ingot, tin block, tin bar, tin rod, tin wire, tin foil, and so on.
