Shenzhen Hothree Technology Co., Ltd.

BERGQUIST GF3500S35  GAP FILLER 3500S35  GAP FILLER TGF 3600 BERGQUIST  GAP FILLER TGF 3600 is a two-component, liquid gap-filling material, cured at either room or elevated temperature, featuring ultra-high thermal [...]

BERGQUIST GPHC3.0,GAP PAD  HC 3.0,GAP PAD TGP HC3000  BERGQUIST GAP PAD TGP HC3000 is a soft and compliant gap filling material with a thermal conductivity  of 3.0 W/m-K.The material offers exceptional thermal performance [...]

BERGQUIST Q-Pad 3 eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. SIL PAD TSP Q2000 may be installed prior to soldering and cleaning without [...]

BERGQUIST GPVOUS  GAP PAD  VO Ultra Soft GAP PAD TGP 1000VOUS BERGQUIST  GAP PAD TGP 1000VOUS is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material [...]