Qingdao DOCBOND NEW MATERIAL CO.,LT
Manufacturer
Electronic glue
Find multiple varieites of Electronic glueQingdao DOCBOND NEW MATERIAL CO.,LT
DOCBOND Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, effectively reducing the impact caused by the mismatching of overall [...]
Application: Mobile phones, laptops, DC, NE vehicle terminals, and other products: PVC, ABS, PMMA, PC, PA, glass, stainless steel, various alloys, carbon fiber, glass fibers, Etc Advantage: One-component A simple [...]
This product provides a strong adhesion seal for shaft seals, metals, glass, plastics, etc., and can replace traditional seal ring. Mainly used in sealing of oil cooling system, engine cover, oil sump and other oil [...]


